G06400 - SEMI G64 - 全面めっきIC用リードフレーム（金，銀，銅，ニッケル，パラジウム/ニッケル，およびパラジウム）の仕様 Revision:SEMI G64-96 (Reapproved 0811) - Superseded

G06400 - SEMI G64 - 全面めっきIC用リードフレーム（金，銀，銅，ニッケル，パラジウム/ニッケル，およびパラジウム）の仕様 Revision:SEMI G64-96 (Reapproved 0811) - SupersededNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI Assembly & Packaging Global Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : P. P. F. SI Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit

4-1022 (Reapproved 0224)

• Order management of CLJs per process order

This Network Communication Standard (NCS) taken together with the SEMI Sensor/Actuator Network standard suite and the PROFINET standard completely and unambiguously defines an open standard providing an industry specific solution to off-the-shelf interoperability of networked devices in semiconductor manufacturing equipment

SEMI E73 — Specification for Vacuum Pump Interfaces – Dry Pumps

注意：本基準中的正式數值皆以國際單位制（SI）表示。下列數值並非正式數值，僅供參考：

SEMI C23-0708 (technical revision)

The assumption of wafer-to-wafer (W2W)

The purpose of this Specification is to standardize requirements for n-butyl acetate used in the semiconductor industry and to document testing procedures to support those specifications

org で入手可能となる。初版は2005年3月発行，前版は2010年3月に発行された。

These Guides may be used to help determine the parameters that should be monitored for UPW that is produced

本仕様では，周波数134

These specifications cover requirements for monocrystalline silicon epitaxial layers on sapphire substrates